Room Temperature, Inductive Amplifier/Inverter & Logic Gates

Amplifier Scalable Device

The amplifier can be designed to operate as an inverter of the inductive logic or of the current. That is indicated in the NOT gate below, as well as in the NOT gate following.

For electrical engineering, the induction junction can be compromised of two large metal bars - preferably of low-carbon copper carbide.

Inductive circuits will require magnetic shielded casing to protect electronics and chemical properties. More importantly human and animal biology can be adversely affected by the frequency ranges and voltage changes in inductive circuitry.

NOR Gate Technology

(Electronics Education 2026)

Frequency And Resistance Relationship

The principle purpose of the devices is to change or switch the current from

i[ in ] to i [ out ], with minimum electrical resistance. That is achived by a current increase where the charge in loop [ out ] must traverse a greater path lengthover the same time period as for loop [ in ]. A current increase is the result for fixed voltage and lower resistance in loop [ out ].

The voltage frequency and current frequency equations are indicated, below.

v = Q * f * r,

i = Q * f

Charge (Q) is constant and variable frequency (f) will increase, while variable resistance (r) must vary inversely proportional to a lower resistance.

Variable resistance is a direct ratio relationship of V/i.

Signals are generated at the base, and output at the amplified emitter. The windings do not have to be placed at the inductive junction, nor should they. They may be placed on the alternative on each of the 2 sets of lengths of the induction loops.

Devices

The circuits must operate at ultra high frequency (UHF), alternating current and inherently much lower operating or variable output resistance than the input resistance. See the Xerqon blog article Quantum Server.

Logical devices will stem from current state changes rather than wasteful voltage state changes. The inductive amplifier is a current inverter. It is also an air-core transformer - far more efficient or less wasteful of power than a metal-core transformer or an alternative, dielectric-core device.

Add more loop rows to the inductive array, including laterally, to devise Boolean logical device from each full inductive circuit array.

Novelty of development comes from creating inductive logic circuits beyond the inverter and its opposite, the inverter.

For simplicity of testing please use electronics breadboards and use the board circuitry, to convert current to voltage, by employing orthogonal current output as voltage. The output voltage may be then measured by a digital oscilloscope. (See Xerqon blog article about Orthogonality.)

Without semiconductor materials being used, the noise floor voltage will be at the very metal substrate amplification. That allows Moore’s Law to be accepted as essentially negligible. To resist current flow rate simply use inductive loop pairs or inductors to perform that function.

The electronic devices will be adhered to glass or a better performance dielectric.

For all circuitry, substitute voltage changes for the corresponding current increases or decreases as required.

Applications

1. One device may replace an entire operational amplifier (op amp), transistor and resistor-inductor-capacitor (RLC) circuit array. Resistors, capacitors and semiconductor junctions generate most of the heat in a RLC circuit, respectively.

   
   
   
   

2. Microelectronics will benefit from low temperature amplifier operation.

   
   

   The circuits may be printed into machine scored glass with very conductive lead carbide which has a low enough melting point to not thermally break warm formed, flawless soda glass.

   
   

   The star cross section, bevelled ridge rotation, tipped, cutting tool would be best tipped with tungsten carbide at the ratio for maximum hardness. At high rate of rotation, it will be able to cut through the soda glass without water cooling.

   
   

   Leas carbide shines like nickel, as it is resistant to corrosion. It is almost as hard as iron. The conclusion is that is does not to be sandwiched between layers of the glass substrate. One backing-layer will be sufficient for mounting circuitry.

   
   
   
   

3. General electronics

   
   
   
   

4. Computer, general circuitry

   
   
   
   

5. Power Industry

Bibliography

Electronics Education, 2026, Facebook, Meta Platforms Inc, <https://www.facebook.com/ElectronicsResearchDevelopment/posts/digital-logic-circuits-can-be-built-using-a-single-type-of-gate-called-a-univers/1386089826868372/>

© Xerqon Pty Ltd 2026