High Saturation Carbon Carbide HSSC™ Microelectronics Circuit Board Substrate

The most favourable circuit board substrate, for resistor based circuits, is a carbide of far less conductive metal than that of the highest resistive circuits, expected to be possible on the printed circuit board. The substrate is known as High Saturation Carbon Carbide (HSCC™).

The backing plate which forms the circuit board substrate should be as flat or thin as possible, for heat sink capacity and to provide high resistance. That prevents the substrate from ever behaving as a short circuit.

The rear of the plate may have their surface area increased with heat sink, pins to carry off printed circuit heat. For mother boards, pins should also be placed on the back of the substrate upper facing surface, for best heat dissipation.

The image example above is a mock up artist impression of what the back of how a current heat sink looks. Pin heat sinks are the superior type of heat regulation device. As lower conducting carbide that any component on the layer above, they are the most unbeatable technology which the market could offer.

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